>. Což by se dalo chápat tak, že proces je ve stavu, při kterém neoslovuje externí zákazníky, takže
>mizí z veřejné roadmapy, ale pro vlastní potřebu (tzn. nějaký Exynos) ho Samsung možná
>využije.

Alebo bude dostupný len "prémiovým zákazníkom" Samsungu..

Tu by sa ešte hodilo

TSMC Exploring On-Chip, Semiconductor-Integrated Watercooling

By Francisco Pires about 11 hours ago
https://www.tomshardware.com/news/tsmc-exploring-on-chip-semiconductor-i...

AMD patents Peltier cooler on chip
Posted by Legit Staff | Thu, Oct 21, 2004
https://www.legitreviews.com/amd-patents-peltier-cooler-on-chip_114554

AMD Files a Patent for Cooling of 3D Stacked Memory
by AleksandarK Jun 28th, 2019
AMD has filed a patent for cooling a 3D stacked memory with thermo-electric coolers - TECs, also known as Peltier devices.
https://www.techpowerup.com/256902/amd-files-a-patent-for-cooling-of-3d-...

To dá niekomu výhodu, ak sa to realizuje. Chladneie 2,6 kW medzi stackovanýmni vrstvami je sila